SMT back furnace welding cooling zone needs to use cooling water to reduce the temperature of the cooling zone, so that the PCB board in a short period of time to reduce to between 35-50 degrees C, so that the PCB board can directly into the next process without buffertime, greatly speed up the production process, improve production efficiency. The cooling zone also effectively solidifies the gaseous flux generated by the high temperature in the furnace, reducing air pollution and reducing the cost of waste recovery.

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